Advanced Surface Mount Technology (ASMT) Reworking - four-day course

Staff involved with the rework of components need more than a basic knowledge of how to handle surface mount devices, and this course provides students with the practical skills needed for the reworking of such surface-mounted connections.

Course overview

This course is designed to provide students with practical skills required in the reworking of complex surface-mounted devices. We use a number of techniques for board preparation and soldering with various lead-free solders and solder pastes, as well as lead solder if required. These are used to ensure students have first-hand knowledge of the attributes of different solders. Because the inspection of complex devices relies heavily on the use of X-ray equipment and specialist optical devices, these are all made available for students to use.

For the first two days of the course the range of components covered includes QFPs, SOICs TSOPs and gull wing devices, including J-lead package (PLCC) devices. The second part of the course is devoted to ball grid arrays and chip scale packages (small and uBGAs) along with quad flat packs with no leads (QFN) devices. We discuss and demonstrate techniques for the safe removal of failed components, board clean-up or preparation, and the onsertion of the new device. These techniques are also suitable for prototype circuit building.

The course explores the use of a range of soldering processes including hot air and infra-red and, when hand soldering, using different gauges of solder wire and a selection of solder iron tips, to enabling staff to achieve the correct volume of solder to deposit on the component pad.

Each student develops time temperature profiles for each BGA, QFN and board used to ensure they understand the difficulties of managing the thermal properties of a PCB with ground- and power-plane layers. Emphasis is placed on the diagnosis of faults that occur when reworking this range of components; these include voids, shorts, insufficient solder and excessive solder, de-wetting, non-wetting, and misplacement. ESD implications are also discussed with respect to handling, storage and packaging.

Assessments at the end of the areas covered will result in an Electronics Yorkshire certificate being awarded to candidates who achieve the required standard. Within this programme students will also be able to take an IPC course of study and receive the IPC Lead Free Surface Mount Rework DVD-67C certificate on successful completion of that course.

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Who will benefit

Anyone associated with the reworking of devices should consider attending this course but we would expect them to have good soldering skills and a sound knowledge of assembly procedures together with an understanding SMT reworking.

 

Course duration, location and booking

This is a four-day course

Courses are normally delivered in our advanced technology centre:

Electronics Yorkshire

Airedale House

Clayton Wood Rise

Leeds LS16 6RF

You can view our list of training course dates in our training calendar.

We may also be able to conduct training on your premises; call us to discuss this option.

Please call us on 0800 610 1601 for prices and to book the course of your choice.

Full Electronics Yorkshire Members undertaking training at our Leeds centre receive a 20% discount on training costs. Discounts can also be offered for multiple bookings onto this course.

If, within seven days of the course commencement date, there are insufficient students booked onto this course, Electronics Yorkshire  maintains the right to cancel and offer alternative dates.